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Deepak Arora

About

  • A solution-driven technologist with expertise in structure-process-property relationships, rheology and capability development for polymers/composites with experience in electronic packaging.

  • Adept at material, design and process development for wafer as well as panel level packaging, including fan-in, fan-out, flip-chip (coreless and thin core) and die-embedding technologies.

  • Experienced in working with domestic and overseas cross-functional teams and partners.

Work Experience

February 2020 - Current

August 2016 - May 2018

October 2011 - May 2016

Associate Professor

INDIAN INSTITUTE OF TECHNOLOGY JODHPUR, Jodhpur, Rajasthan, India
Department of Chemical Engineering
Research Areas: Polymer nanocomposites for electronic packaging and healthcare

Research Packaging Engineer

FUJIFILM ELECTRONIC MATERIALS, North Kingstown, RI, USA
Developed materials for advanced electronic packaging. Successfully formulated a polymer dielectric platform that passed reliability at an industrial consortium led by a partner lab.

  • Process Development Lead

  • Company: Intel Corporation, Chandler, AZ, USA

  • Role: Substrate Technology Development

  • Enabled high-volume manufacturing, saving $4 billion and enhancing competitive advantage.

  • Developed coreless and die-embedding technologies, achieving 90% yield in technology development.

  • Received nine departmental, two divisional, one group, and seven peer-to-peer awards.

Education

MS - PhD

August 2004- May 2010

Polymer Science and Engineering, University of Massachusetts Amherst 
Thesis: Structure-property evolution during polymer crystallization (advisor: H. Henning
Winter)

BTech - MTech

July 1999 - June 2004

Chemical Engineering, Indian Institute of Technology Madras

Honors and Awards

Invited Talks and Workshops

  • Polymer Dielectrics for Semiconductors: Opportunities and Challenges in Advanced Electronic Packaging
    Invited talk, Department of Chemical Engineering, IIT Ropar, 2024.

  • Thermal Analysis and Rheology – Hot Stage Microscopy
    Invited virtual short course, NATAS, Thermal Analysis Forum of Delaware Valley (TAFDV), 2022.

  • Innovation in IC Packaging – India’s Perspective & Approach
    Invited panelist, Workshop at Semiconductor Lab (SCL), Mohali, 2022.

  • Advances in Electronic Packaging with C4DFED
    Invited talk, IIT Mandi, 2022.

  • Advances in Electronic Packaging
    Invited talk, Semiconductor Laboratory (SCL), Mohali, 2022.

  • Thermal Analysis Forum of Delaware Valley
    Invited virtual poster evaluation session, 2022.

  • International Colloquium on Technology Readiness for High Volume Chip Manufacturing
    Invited virtual talk, ICTFab, organized by IIT Mandi, 2021.

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Recognitions and Awards

  • Department Recognition, Intel Corporation

    • Enabling a process to improve inline patterning yield by 10%, 2015.

    • Enabling a process to reduce dielectric cracks to prevent reliability failures, 2015.

    • Developing a factory capability for 2D ID laser mark on substrates to facilitate unit-level tracking for internal yield segmentation and assembly process performance correlation, 2014.

    • Enabling externally procured notched CCL cores as a substitute for internal notching, leading to significant cost savings, 2014.

  • Technology Manufacturing Group Excellence Award, Intel Corporation
    Contributions to substrate technology and core-less technology development, 2014.

  • Assembly & Test Technology Development Divisional Recognition, Intel Corporation
    Developing and implementing a combined change process to improve dielectric adhesion with electro-less deposited copper, 2013.

  • Finalist for the AkzoNobel Student Award
    Polymeric Materials: Science and Engineering Program, American Chemical Society, 2010.

  • GATE Achievement
    Secured a place among the top 2.5% of aspirants in the National Graduate Test in Engineering (GATE), 2002.

  • Entrance Examination Achievement
    Ranked among the top 1% of aspirants in the entrance examination for Indian Institutes of Technology, 1999.

  • State Merit List Award
    Awarded a silver medal for attaining sixth place in the State's merit list out of 200,000 entrants, 1996.

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